 The production is carried out by Kepo Plastics and Sin Luen Kepo in Huiyany City Guangdong Province of the People¡¦s Republic of China (¡§The PRC¡¨), housing almost 2,500 workers producing an average output of 10,000,000 units per year. The installation of up-to-date facilities like advance mounting machines for Surface-Mount-Devices (¡§SMDs¡¨), advanced bonding machines for fully automatic bonding of Integrated Circuits (¡§ICs¡¨) and fine-pitch heat-sealing machine for LCD-PCD connecting. Environmental Stress Screening (¡§ESS¡¨) oven for reliability testing helps to strengthen our competitive power and keeps our products having good form factors as well as good quality.
The followings are some of the facilities and equipment in our
Huiyang factory:
| Type |
No.
of units |
| Fully automatic
Chip-On-Board (COB) bonding machine |
63 |
| High precision fine
pitch heat-sealing machine |
57 |
| High speed
Surface-Mount-Device (SMD) mounter |
17 |
| Hot-air reflow oven |
10 |
| Automation silk
screen/pad printing machine |
7 |
| ROI Computerized 3D
projector (0.000039" resolution) |
1 |
| Computerized in-circuit
tester |
5 |
| Programmable
environmental stress screening chamber |
3 |
| ESD GUN |
2 |
| Injection Machine |
22 |
 In order to facilitate our future expansion and development, Kessel Group has invested in a new factory in Dongguan, which has been completed and fully operational since May 2000. The new factory in Dongguan has a total of 50,000 square meters which includes a LCD factory (30,000 square meters floor space) for TN and STN LCD manufacturing and fine-pitch LCD module assembly; a main factory (30,000 square meters floor space) manufacturing advanced PDA as well as advanced Telecommunication and Wireless Communication products; a plastic factory (8,500 square meters) for plastic mould making and plastic injection, spraying and silk screen processes. The whole factory is able to house almost 5,000 workers.
The followings are some of the facilities and equipment in our
Dongguan factory:
| Type |
No.
of units |
| Fully automatic
Chip-On-Board (COB) bonding machine |
7 |
| High speed
Surface-Mount-Device (SMD) mounter |
14 |
| Hot-air reflow oven |
8 |
| RF Communication tester |
21 |
| Digit radio
communication |
11 |
| RF signal generator |
7 |
| Double wave solder oven |
4 |
| Computerized in-circuit
function tester |
37 |
| Telephone acoustic
analyzer |
5 |
| Thermo shock oven |
1 |
| Low temperature oven |
1 |
| High temperature oven |
1 |
| Temperature &
humidity chamber |
2 |
pervious | next |
